Inventor
Achyuta Achari
Inventor
Canton, MI, US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
Y10TTechnical subjects covered by former us classification21%
B23KSoldering or unsoldering7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
C22CAlloys4%
C23FNon-mechanical removal of metallic material from surface4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
C23CCoating metallic material2%
F02BInternal-combustion piston engines2%
PatentTitleYear
7,156,279'System and method for mounting electronic components onto flexible substrates'20076,998,293'Flip-chip bonding method'20066,852,932'Circuit board with air-bridge'20056,810,723'Engine combustion monitoring and control with integrated cylinder head gasket combustion sensor'20046,729,023'Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material'20046,601,292'Method for the connection and repair of flex and other circuits'20036,555,015'Multi-layer printed circuit board and method of making same'20036,528,736'Multi-layer printed circuit board and method of making same'20036,475,703'Method for constructing multilayer circuit boards having air bridges'20026,467,161'Method for making a circuit board'20026,459,041'Etched tri-layer metal bonding layer'20026,454,878'Cladded material construction for etched-tri-metal circuits'20026,403,893'Circuit board and a method for making the same'20026,307,240'Pulsed etching manufacturing method and system'20016,274,819'Method and article for the connection and repair of flex and other circuits'20016,270,354'Multi-connectable printed circuit board'20016,250,541'Method of forming interconnections on electronic modules'20016,168,725'Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromates'20016,082,610'Method of forming interconnections on electronic modules'20006,019,910'Etching tri-metal layers to form electronic circuits using aqueous alkaline solutions including nitrates'20006,011,313'Flip chip interconnections on electronic modules'20005,996,222'Soldering process with minimal thermal impact on substrate'19995,871,690'Low-temperature solder compositions'19995,863,493'Lead-free solder compositions'19995,429,689'Lead-free solder alloys'19954,237,722'Exhaust gas sensor electrode improvement'19804,225,559'Ceramic element sensor'1980Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1980–2000Patents assigned to FORD MOTOR CO (9)· patent assignee history
1980Based in Detroit, MI, US· patent location history
1995–2007Based in Canton, MI, US· patent location history
2001–2006Patents assigned to VISTEON GLOBAL TECH INC (17)· patent assignee history
2007Patents assigned to VISTEON GLOBAL TECHNOLOGIE INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VISTEON GLOBAL TECH INC | 17 | 2001–2006 |
| FORD MOTOR CO | 9 | 1980–2000 |
| VISTEON GLOBAL TECHNOLOGIE INC | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Canton, MI, US | 25 | 1995–2007 |
| Detroit, MI, US | 2 | 1980 |