Inventor
Yi-Wen Wu
Inventor
New Taipei, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
B29CShaping or joining of plastics6%
B29LIndexing scheme associated with subclass b29c, relating to particular articles6%
G01RMeasuring electric variables6%
H02JElectric power networks6%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
PatentTitleYear
11,133,265Integrated fan-out package and method of fabricating the same202111,114,313Wafer level mold chase202111,101,214Package structure with dam structure and method for forming the same202111,094,625Semiconductor package with improved interposer structure20219,692,232'Mixed signal controller'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017Patents assigned to UNIV MACAU (1)· patent assignee history
2017Based in Macau, CN· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2021Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2021 |
| UNIV MACAU | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 3 | 2021 |
| Macau, CN | 1 | 2017 |