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Inventor

Yasuhiro Okada

Inventor
Tokyo, JP

Overview

50→
Patents
1976–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 50 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Pprimary
H01PWaveguides13%
H04BTransmission11%
Y10TTechnical subjects covered by former us classification8%
H01QAntennas, i.e. radio aerials7%
H05KPrinted circuits7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling3%
G01SRadio direction-finding3%
H01LSemiconductor devices3%
H01RElectrically-conductive connections3%
PatentTitleYear
10,529,062Image processing device202010,374,279Connector device and communication system201910,362,841Ornament201910,327,675Motor function analysis system and operational method of system201910,283,833Connector device and communication device201910,088,365Laser annealing apparatus201810,014,566Connector apparatus and communication system20189,866,272'Communication system comprising a connector having first and second waveguides disposed in proximity to each other for coupling millimeter-wave data signals'20189,742,743'Information processing apparatus and mobile terminal device'20179,728,833'Connector apparatus and radio transmission system'20179,728,834'Connector apparatus and wireless transmission system'20179,705,202'Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system'20179,698,460'Transmission of signals via a high-frequency waveguide'20179,673,165'Component mounting apparatus'20179,647,311'Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission method'20179,628,143'Waveguide, waveguide manufacturing method, and wireless transmission system'20179,547,190'Component mounting apparatus'20179,344,197'Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission method'20169,246,205'Transmission of signals via a high-frequency waveguide'20169,123,840'Solar cell element manufacturing method, solar cell element, and solar cell module'20159,088,352'Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission'20159,007,981'Electronic device, signal transmission device, and signal transmission method'20158,983,399'Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system'20158,848,389'Transmission device and method for manufacturing same, and wireless transmission device and wireless transmission method'20148,736,396'Radio communicating device, rotational structure, and electronic device'20148,725,069'Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission method'20148,630,209'Wireless transmission system and wireless transmission method'20148,078,310'Component crimping apparatus control method, component crimping apparatus, and measuring tool'20117,875,138'Adhesive tape applying apparatus and tape splicing method'20116,190,294'Horizontal machine tool'20015,999,920'System for assisting in management of packaging plant'19995,982,119'Motor drive apparatus including braking means'19995,959,854'Voltage step-up circuit and method for controlling the same'19995,698,385'Silver halide photosensitive material'19975,675,348'Feedome, primary radiator, and antenna for microwave'19975,636,962'Automatic transfer apparatus'19975,607,097'Component-mounted circuit board production system'19975,563,480'Load and supply voltage sensitive speed control system for DC brushless fan motors'19965,368,150'Pallet exchange apparatus'19945,330,168'Device for clamping a workpiece'19945,291,104'DC commutatorless motor'19945,218,200'Image scanner with turnable reflecting plate for scanning objects at different locations'19935,192,902'Velocity/phase controller for DC servo motor'19935,162,087'Anisotropic conductive adhesive compositions'19925,029,234'System and method for communicating a vehicle with a calling party'19914,881,614'Motorcycle'19894,808,122'Cable connector with stepped connecting element'19894,795,378'Terminal pin'19894,410,979'Multiplexed signal receiver'19833,993,524'Adhesive bonding method allowing nondestructive separation of bonded materials'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1983–1999Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (7)· patent assignee history
1989–2019Based in Tokyo, JP· patent location history
1991–2020Based in Kanagawa, JP· patent location history
1993–1999Based in Yonago, JP· patent location history
1994–2001Based in Nagoya, JP· patent location history
1997–2018Patents assigned to SONY CORP (15)· patent assignee history
2011–2020Patents assigned to OKADA YASUHIRO (10)· patent assignee history
2011–2019Based in Osaka, JP· patent location history
2014–2015Patents assigned to KAWAMURA HIROFUMI (5)· patent assignee history
2017–2019Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (7)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SONY CORP151997–2018
OKADA YASUHIROself102011–2020
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD71983–1999
SONY SEMICONDUCTOR SOLUTIONS CORP72017–2019
KAWAMURA HIROFUMI52014–2015
Locations
LocationPatentsSpan
Tokyo, JP141989–2019
Kanagawa, JP121991–2020
Nagoya, JP41994–2001
Osaka, JP32011–2019
Yonago, JP31993–1999