LexDanaLexDanabeta
Inventor

Takuya Komeda

Inventor
Osaka, JP

Overview

2→
Patents
2016–2018
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material50%
H05KPrinted circuits50%
PatentTitleYear
10,138,558Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same20189,374,913'Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to UYEMURA C & CO LTD (1)· patent assignee history
2016–2018Based in Osaka, JP· patent location history
2018Patents assigned to UEMURA KOGYO KK (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UEMURA KOGYO KK12018
UYEMURA C & CO LTD12016
Locations
LocationPatentsSpan
Osaka, JP22016–2018