Inventor
MENG-PEI LU
Inventor
TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices46%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
12,525,531Protection liner on interconnect wire to enlarge processing window for overlying interconnect via202612,412,837Interconnect structure including topological material202512,347,776Integrated chip with graphene based interconnect202512,300,599Method for forming semiconductor structure202512,218,060Integrated chip with graphene based interconnect202512,068,253Semiconductor structure with two-dimensional conductive structures202412,027,419Semiconductor device including liner structure202411,908,794Protection liner on interconnect wire to enlarge processing window for overlying interconnect via202411,682,616Semiconductor structure and method for forming the same202311,551,967Via structure and methods for forming the same202311,309,241Protection liner on interconnect wire to enlarge processing window for overlying interconnect via2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (11)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 11 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 11 | 2022–2026 |