Inventor
Haruhiko Sakai
Inventor
Ota, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H10DInorganic electric semiconductor devices31%
B29CShaping or joining of plastics15%
H03KPulse technique8%
PatentTitleYear
8,241,958'Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame'20127,839,004'Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame'20107,030,501'Semiconductor device and switching element'20066,833,616'Multilayer wiring board with mounting pad'20046,833,608'Semiconductor device and packaging system therefore'20046,818,969'Semiconductor device'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2010Patents assigned to SANYO ELECTRIC CO (4)· patent assignee history
2004–2012Based in Ota, JP· patent location history
2006Patents assigned to KANTO SANYO SEMICONDUCTORS CO (1)· patent assignee history
2006Based in Gunma, JP· patent location history
2010–2012Patents assigned to SANYO SEMICONDUCTOR CO LTD (2)· patent assignee history
2012Patents assigned to SAKAI HARUHIKO (1)· patent assignee history
2012Patents assigned to SEMICONDUCTOR COMPONENTS IND (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANYO ELECTRIC CO | 4 | 2004–2010 |
| SANYO SEMICONDUCTOR CO LTD | 2 | 2010–2012 |
| KANTO SANYO SEMICONDUCTORS CO | 1 | 2006 |
| SAKAI HARUHIKOself | 1 | 2012 |
| SEMICONDUCTOR COMPONENTS IND | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ota, JP | 5 | 2004–2012 |
| Gunma, JP | 1 | 2006 |