LexDanaLexDanabeta
Inventor

Yi Guo

Inventor
Newark, DE, US

Overview

76→
Patents
2008–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 76 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Wprimary
H04WWireless communication networks20%
C09GPolishing compositions14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
C09KMaterials for miscellaneous applications, not provided for elsewhere11%
B24BMachines, devices, or processes for grinding or polishing9%
H01LSemiconductor devices7%
H04LTransmission of digital information, e.g. telegraphic communication6%
B24DTools for grinding, buffing or sharpening3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry1%
PatentTitleYear
10,880,857Inter-radio access technology positioning measurements in new radio systems202010,873,889Handover apparatus and method202010,856,200Reporting cell band information in a communication network202010,855,461Security key change method, base station, and user equipment202010,849,181NR RRC connection setup optimisation202010,841,709Nanocomposite graphene polymer membrane assembly, and manufacturing method thereof202010,820,373Methods to indicate a version of packet data convergence protocol (PDCP) in dual connectivity arrangements202010,798,672Inter-radio access technology positioning measurements in new radio systems202010,798,746Communication method used for random access, terminal, and base station202010,785,824Information processing method and related apparatus202010,781,343Acid polishing composition and method of polishing a substrate having enhanced defect inhibition202010,694,576RRC connection release method, apparatus, and device202010,683,439Polishing composition and method of polishing a substrate having enhanced defect inhibition202010,667,203Cell selection method and apparatus202010,645,732Method, device, and system for determining timing advance grouping202010,638,440Method for determining measurement gap length and network device202010,584,265Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using them202010,569,384Chemical mechanical polishing pad and polishing method202010,531,439Communication method and communications device202010,517,010Wireless local area network WLAN measurement and reporting method and related device201910,508,221Aqueous low abrasive silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of making and using them201910,491,336Data processing method and apparatus201910,464,188Chemical mechanical polishing pad and polishing method201910,425,876Data forwarding method, device, and communications system201910,362,519Handover apparatus and method201910,356,678Method for acquiring UE capability, terminal, and base station201910,324,659Detection of over-access of memory shared among multiple processes201910,278,147Method for determining measurement gap length and network device201910,200,916Method of distributing security key context, mobility management entity, and base station201910,191,927Selecting previously-presented content items for presentation to users of a social networking system201910,154,450Cell selection method and apparatus201810,119,048Low-abrasive CMP slurry compositions with tunable selectivity201810,123,204Splitting method, base station, and user equipment201810,116,364Method for determining rank indication RI bit number, base station, and terminal201810,085,287Method, device, and system for determining timing advance grouping201810,051,478Method for scheduling unlicensed spectrum, user equipment, and base station201810,028,150Method and system for contending for channel of unlicensed frequency band, and apparatus20189,803,108'Aqueous compositions of stabilized aminosilane group containing silica particles'20179,783,702'Aqueous compositions of low abrasive silica particles'20179,775,092'User equipment, network device and method for accessing network system'20179,730,124'Method for acquiring UE capability, terminal, and base station'20179,718,745'Premixer, radially fixed bed reactor, reaction system for oxidative dehydrogenation'20179,706,506'Method and apparatus for controlling transmitting power'20179,686,730'Data forwarding method, device, and communications system'20179,629,192'Method, terminal, and system for realizing device to device communication'20179,534,148'Method of polishing semiconductor substrate'20179,484,212'Chemical mechanical polishing method'20169,419,693'Method for determining rank indication RI bit number, base station, and terminal'20169,393,542'Multi-stage plasma reactor system with hollow cathodes for cracking carbonaceous material'20169,369,929'User equipment, network device and method for accessing network system'20169,293,339'Method of polishing semiconductor substrate'20169,275,899'Chemical mechanical polishing composition and method for polishing tungsten'20169,210,705'Method and device for data transmission'20159,060,364'Scheduling method and device'20159,012,327'Low defect chemical mechanical polishing composition'20158,983,517'Method, device, and system for determining timing advance grouping'20158,865,013'Method for chemical mechanical polishing tungsten'20148,790,160'Chemical mechanical polishing composition and method for polishing phase change alloys'20148,737,464'Adaptive quantization for perceptual video coding'20148,568,610'Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate'20138,513,126'Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate'20138,496,843'Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride'20138,491,808'Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride'20138,492,277'Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride'20138,444,728'Stabilized chemical mechanical polishing composition and method of polishing a substrate'20138,440,094'Method of polishing a substrate'20138,435,420'Method of polishing using tunable polishing formulation'20138,435,790'Methods of modulating lipid concentrations in eukaryotic cells'20138,431,490'Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal'20138,309,468'Chemical mechanical polishing composition and method for polishing germanium-antimony-tellurium alloys'20128,232,208'Stabilized chemical mechanical polishing composition and method of polishing a substrate'20128,119,529'Method for chemical mechanical polishing a substrate'20128,025,813'Chemical mechanical polishing composition and methods relating thereto'20117,991,236'Discardable lower layer adaptations in scalable video coding'20117,603,452'Networked computer environment assurance system and method'20097,370,356'Distributed network monitoring system and method'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2009Based in Fremont, CA, US· patent location history
2011–2016Patents assigned to ROHM & HAAS ELECT MAT (18)· patent assignee history
2011–2020Based in Newark, DE, US· patent location history
2012–2016Patents assigned to GUO YI (18)· patent assignee history
2012–2014Patents assigned to REDDY KANCHARLA-ARUN KUMAR (12)· patent assignee history
2015–2020Patents assigned to HUAWEI TECH CO LTD (33)· patent assignee history
2015–2020Based in Shanghai, CN· patent location history
2015–2020Based in Shenzhen, CN· patent location history
2016–2020Patents assigned to ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC (11)· patent assignee history
2016–2020Based in Beijing, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUAWEI TECH CO LTD332015–2020
GUO YIself182012–2016
ROHM & HAAS ELECT MAT182011–2016
REDDY KANCHARLA-ARUN KUMAR122012–2014
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC112016–2020
Locations
LocationPatentsSpan
Newark, Delaware, US292011–2020
Shanghai, CN252015–2020
Shenzhen, CN122015–2020
Beijing, CN32016–2020
Fremont, California, US22008–2009