Inventor
Qihao ZHU
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
C23CCoating metallic material9%
G06FElectric digital data processing9%
G06NComputing arrangements based on specific computational models9%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes9%
H04LTransmission of digital information, e.g. telegraphic communication9%
H10DInorganic electric semiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to TENCENT TECH SHENZHEN CO LTD (1)· patent assignee history
2022–2025Based in CN· patent location history
2025Patents assigned to UNIV BEIJING (1)· patent assignee history
2026Patents assigned to APPLIED MAT INC (1)· patent assignee history
2026Patents assigned to APPLIED MATERIALS INC (1)· patent assignee history
2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MAT INC | 1 | 2026 |
| APPLIED MATERIALS INC | 1 | 2026 |
| TENCENT TECH SHENZHEN CO LTD | 1 | 2022 |
| UNIV BEIJING | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 2 | 2026 |
| CN | 2 | 2022–2025 |