Inventor
Chi-Hsuan Cheng
Inventor
Kaohsiung, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10DInorganic electric semiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01PWaveguides10%
H03HImpedance networks, e.g. resonant circuits10%
PatentTitleYear
10,446,682Method of forming semiconductor device201910,396,419Common-mode signal absorber201910,283,415Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereof201910,217,866Semiconductor device and method of forming the same201910,211,107Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean step201910,211,496Common-mode signal absorber and equivalent circuit thereof201910,109,531Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2019Patents assigned to UNITED MICROELECTRONICS CORP (5)· patent assignee history
2018Based in Kaoshiung, TW· patent location history
2019Patents assigned to UNIV NAT TAIWAN (2)· patent assignee history
2019Based in Kaohsiung, TW· patent location history
2019Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 5 | 2018–2019 |
| UNIV NAT TAIWAN | 2 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 4 | 2019 |
| Taipei, TW | 2 | 2019 |
| Kaoshiung, TW | 1 | 2018 |