Inventor

Takahiro Shimbo

Inventor

Tokyo, JP

Overview

1→

Patents

2020

Patent span

Performing operations

Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary

B22FWorking metallic powder14%

B23KSoldering or unsoldering14%

B29CShaping or joining of plastics14%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering14%

G21KHandling of particles or ionising radiation not otherwise provided for14%

H01JElectric discharge tubes or discharge lamps14%

Y02PClimate change mitigation technologies in the production or processing of goods14%

PatentTitleYear

10,566,171Three-dimensional layer-by-layer shaping apparatus, three-dimensional layer-by-layer shaping apparatus control method, and three-dimensional layer-by-layer shaping apparatus control program2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020Patents assigned to TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (1)· patent assignee history

2020Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING	1	2020

Locations

Location	Patents	Span
Tokyo, JP	1	2020