Inventor
Masashi Kumagai
Inventor
Hitachi, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification18%
H05KPrinted circuits17%
C23CCoating metallic material14%
C25DProcesses for the electrolytic or electrophoretic production of coatings12%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
C23FNon-mechanical removal of metallic material from surface3%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations2%
PatentTitleYear
8,568,856'Two-layer flexible substrate'20138,449,751'Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same'20138,182,594'Electroless nickel plating liquid'20128,084,044'Pseudomonas aeruginosa outer membrane protein PA0427'20117,824,534'Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith'20107,777,078'Copper electrolytic solution and electrolytic copper foil produced therewith'20107,771,835'Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same'20107,678,257'Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same'20107,651,783'Surface treated copper film'20107,432,335'Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same'20087,378,160'Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same'20087,300,501'Electroless gold plating liquid'20077,144,491'Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith'20067,109,273'Solid silane coupling agent composition, process for producing the same, and resin composition containing the same'20067,094,845'Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same'20067,045,461'Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these'20067,005,055'Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same'20066,921,577'Water-based metal surface treatment agent'20056,916,865'Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins'20056,835,241'Surface treatment for copper foil'20046,731,959'Portable telephone set with hinged lid'20046,710,181'Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the same'20046,605,356'Metal surface treatment agent, and metal material coated with same'20035,258,522'Imidazole-silane compounds and metal surface finishing agent containing the same'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2013Patents assigned to NIPPON MINING CO (6)· patent assignee history
1993Based in Toda, JP· patent location history
2003–2010Patents assigned to NIKKO MATERIALS CO LTD (15)· patent assignee history
2003–2013Based in Hitachi, JP· patent location history
2004–2013Based in Kitaibaraki, JP· patent location history
2004Based in Kanagawa, JP· patent location history
2011–2013Patents assigned to KUMAGAI MASASHI (4)· patent assignee history
2011Based in Yokohama, JP· patent location history
2012Patents assigned to HINO EIJI (1)· patent assignee history
2013Patents assigned to HANAFUSA MIKIO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NIKKO MATERIALS CO LTD | 15 | 2003–2010 |
| NIPPON MINING CO | 6 | 1993–2013 |
| KUMAGAI MASASHIself | 4 | 2011–2013 |
| HANAFUSA MIKIO | 1 | 2013 |
| HINO EIJI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachi, JP | 16 | 2003–2013 |
| Kitaibaraki, JP | 5 | 2004–2013 |
| Yokohama, JP | 1 | 2011 |
| Kanagawa, JP | 1 | 2004 |
| Toda, JP | 1 | 1993 |