Inventor
WEN-MING CHEN
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
G06FElectric digital data processing6%
H04LTransmission of digital information, e.g. telegraphic communication6%
H04WWireless communication networks6%
H10DInorganic electric semiconductor devices6%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use6%
PatentTitleYear
12,087,618Method for forming semiconductor die having edge with multiple gradients202411,527,504Conductive external connector structure and method of forming202211,367,658Semiconductor die singulation and structures formed thereby202211,349,742Modem and communication method202211,211,318Bump layout for coplanarity improvement2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2021–2024Based in TW· patent location history
2022Patents assigned to PEGATRON CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2021–2024 |
| PEGATRON CORP | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2021–2024 |