Inventor
Ting-Ying Chien
Inventor
Hsinchu, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems33%
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
B81BMicrostructural devices or systems, e.g. micromechanical devices17%
PatentTitleYear
9,776,857'Methods of fabricating micro electro mechanical system structures'20179,481,567'MEMS structure, cap substrate and method of fabricating the same'20169,230,918'Semiconductor package structure, alignment structure, and alignment method'20169,139,423'Micro electro mechanical system structures'20158,741,738'Method of fabrication of a semiconductor apparatus comprising substrates including Al/Ge and Cu contact layers to form a metallic alloy'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2015Patents assigned to CHIEN TING-YING (2)· patent assignee history
2014–2015Patents assigned to CHIU YI HSUN (2)· patent assignee history
2014–2015Patents assigned to NI CHYI-TSONG (2)· patent assignee history
2014–2015Patents assigned to SU CHING-HOU (2)· patent assignee history
2014–2017Based in Hsinchu, TW· patent location history
2016–2017Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 3 | 2016–2017 |
| CHIEN TING-YINGself | 2 | 2014–2015 |
| CHIU YI HSUN | 2 | 2014–2015 |
| NI CHYI-TSONG | 2 | 2014–2015 |
| SU CHING-HOU | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 2014–2017 |