Inventor
KOSHUN SAITO
Inventor
JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H10DInorganic electric semiconductor devices8%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
LOC134%
PatentTitleYear
12,354,981Semiconductor device and method for manufacturing the same202512,347,756Semiconductor device202512,261,094Semiconductor device including lead with varying thickness202512,113,009Semiconductor device2024D1042376Semiconductor module202412,051,633Semiconductor device202412,009,287Semiconductor device with packaging material and metal member protruding from the packaging material202411,996,354Semiconductor device202411,955,411Semiconductor device202411,901,316Semiconductor device202411,894,281Semiconductor device including lead with varying thickness202411,854,923Semiconductor device202311,776,891Semiconductor device202311,742,279Semiconductor device202311,728,298Semiconductor device and method for manufacturing the same2023D0993201Semiconductor module202311,652,033Semiconductor device202311,646,251Semiconductor device202311,600,561Semiconductor device202311,502,014Semiconductor device202211,342,290Semiconductor device202211,227,827Semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to ROHM CO LTD (22)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ROHM CO LTD | 22 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 22 | 2022–2025 |