Inventor
Tobias Franz Wolfgang Hoechbauer
Inventor
AT
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10DInorganic electric semiconductor devices26%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B23KSoldering or unsoldering4%
H05KPrinted circuits4%
PatentTitleYear
12,412,740Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device202511,881,397Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device202411,576,259Carrier, laminate and method of manufacturing semiconductor devices202311,557,506Methods for processing a semiconductor substrate202311,476,111Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device202211,373,863Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INFINEON TECHNOLOGIES AG (6)· patent assignee history
2022–2025Based in AT· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| AT | 6 | 2022–2025 |