Inventor
Willmar Subido
Inventor
Garland, TX, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
H01LSemiconductor devices23%
B23KSoldering or unsoldering15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
G01RMeasuring electric variables3%
PatentTitleYear
10,559,537Wire bond wires for interference shielding202010,490,528Embedded wire bond wires201910,115,678Wire bond wires for interference shielding201810,008,469Wafer-level packaging using wire bond wires in place of a redistribution layer20189,812,402'Wire bond wires for interference shielding'20179,761,554'Ball bonding metal wire bond wires to metal pads'20179,530,749'Coupling of side surface contacts to a circuit platform'20169,502,372'Wafer-level packaging using wire bond wires in place of a redistribution layer'20169,490,222'Wire bond wires for interference shielding'20167,476,597'Methods and systems for laser assisted wirebonding'20096,855,578'Vibration-assisted method for underfilling flip-chip electronic devices'20056,800,555'Wire bonding process for copper-metallized integrated circuits'20046,521,479'Repackaging semiconductor IC devices for failure analysis'20036,329,722'Bonding pads for integrated circuits having copper interconnect metallization'20016,268,662'Wire bonded flip-chip assembly of semiconductor devices'20016,182,882'Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe'20016,131,792'Balancing of x and y axis bonding by 45 degree capillary positioning'20006,112,973'Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe'20006,089,443'Balancing of x and y axis bonding by 45 degree capillary positioning'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2009Patents assigned to TEXAS INSTRUMENTS INC (10)· patent assignee history
2000–2017Based in Garland, TX, US· patent location history
2016–2020Patents assigned to INVENSAS CORP (9)· patent assignee history
2017–2020Based in San Jose, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 10 | 2000–2009 |
| INVENSAS CORP | 9 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Garland, Texas, US | 14 | 2000–2017 |
| San Jose, California, US | 5 | 2017–2020 |