Inventor
MIZUHO ISHIKAWA
Inventor
JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Bprimary
H04BTransmission20%
H01LSemiconductor devices13%
H01PWaveguides13%
H03FAmplifiers13%
H03HImpedance networks, e.g. resonant circuits13%
H05KPrinted circuits13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
12,483,279Communication circuit and communication device202512,154,847Semiconductor device including semiconductor chip having elongated bumps202411,855,677High-frequency signal transmission-reception circuit202311,601,153High-frequency signal transmission-reception circuit202311,289,415Semiconductor device including semiconductor chip having elongated bumps2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to MURATA MANUFACTURING CO (5)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 5 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 5 | 2022–2025 |