Inventor

MICHAEL J. SEDDON

Inventor

US

Overview

2021–2025

Patent span

Electricity

Primary field (CPC H)

Patents· 75 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices29%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%

H10DInorganic electric semiconductor devices5%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%

B23KSoldering or unsoldering2%

B24BMachines, devices, or processes for grinding or polishing2%

H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems2%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%

G01RMeasuring electric variables1%

PatentTitleYear

12,476,132Curved semiconductor die systems and related methods2025 12,469,709Semiconductor package electrical contact structures and related methods2025 12,444,609Silicon-on-insulator die support structures and related methods2025 12,431,359Semiconductor package electrical contacts and related methods2025 12,376,333Configurable low ohmic power circuits2025 12,374,555Die sidewall coatings and related methods2025 12,374,554Semiconductor packages with die including cavities and related methods2025 12,354,917Singulation systems and related methods2025 12,341,069Backside metal patterning die singulation system and related methods2025 12,322,632Substrate alignment systems and related methods2025 12,315,765Backside metal patterning die singulation systems and related methods2025 12,272,572Non-planar semiconductor packaging systems and related methods2025 12,266,590Dual side direct cooling semiconductor package2025 12,255,167Semiconductor packages with an intermetallic layer2025 12,230,559Semiconductor device and method of forming micro interconnect structures2025 12,230,502Semiconductor package stress balance structures and related methods2025 12,230,543Die cleaning systems and related methods2025 12,230,551Immersion direct cooling modules2025 12,211,784SOI substrate and related methods2025 12,154,783Semiconductor wafer and method of wafer thinning2024 12,154,877Semiconductor wafer and method of ball drop on thin wafer with edge support ring2024 12,148,665Jet ablation die singulation systems and related methods2024 12,132,005Supports for thinned semiconductor substrates and related methods2024 12,132,008Multidie supports and related methods2024 12,119,294Through-substrate via structure and method of manufacture2024 12,094,750Tape heating methods2024 12,040,192Die sidewall coatings and related methods2024 12,040,295Semiconductor device with backmetal and related methods2024 12,020,972Curved semiconductor die systems and related methods2024 11,987,874Backside metal formation methods and systems2024 11,972,980Singulation systems and related methods2024 11,948,880SOI substrate and related methods2024 11,942,366Backside metal patterning die singulation systems and related methods2024 11,929,285Backside metal patterning die singulation system and related methods2024 11,908,699Semiconductor packages with die including cavities2024 11,901,184Backmetal removal methods2024 11,894,245Non-planar semiconductor packaging systems and related methods2024 11,854,995Supports for thinned semiconductor substrates and related methods2023 11,854,889Die cleaning systems and related methods2023 11,830,771Semiconductor substrate production systems and related methods2023 11,830,756Temporary die support structures and related methods2023 11,823,965Substrate processing carrier2023 11,823,953Semiconductor substrate processing methods2023 11,756,830Jet ablation die singulation systems and related methods2023 11,710,691Semiconductor device and method of forming micro interconnect structures2023 11,694,937Semiconductor wafer and method of probe testing2023 11,676,863Structures for aligning a semiconductor wafer for singulation2023 11,651,998Plasma die singulation systems and related methods2023 11,652,010Semiconductor substrate crack mitigation systems and related methods2023 11,616,008Through-substrate via structure and method of manufacture2023 11,605,561Backside metal removal die singulation systems and related methods2023 11,581,223Backside metal patterning die singulation system and related methods2023 11,508,579Backside metal photolithographic patterning die singulation systems and related methods2022 11,495,493Backside metal patterning die singulation systems and related methods2022 11,495,529SOI substrate and related methods2022 11,437,291Multichip module supports and related methods2022 11,430,746Multidie supports for reducing die warpage2022 11,404,277Die sidewall coatings and related methods2022 11,393,692Semiconductor package electrical contact structures and related methods2022 11,387,145Jet ablation die singulation systems and related methods2022 11,387,130Substrate alignment systems and related methods2022 11,373,859Semiconductor substrate singulation systems and related methods2022 11,367,619Semiconductor package electrical contacts and related methods2022 11,361,970Silicon-on-insulator die support structures and related methods2022 11,348,796Backmetal removal methods2022 11,342,189Semiconductor packages with die including cavities and related methods2022 11,289,380Backside metal patterning die singulation systems and related methods2022 11,289,381Methods of aligning a semiconductor wafer for singulation2022 11,289,358Wafer thinning systems and related methods2022 11,254,565Absolute and differential pressure sensors and related methods2022 11,257,724Semiconductor wafer and method of probe testing2022 11,222,840Silicon-on-insulator (SOI) substrate and related methods2022 11,211,359Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates2021 11,164,835Semiconductor wafer and method of ball drop on thin wafer with edge support ring2021 11,152,211Semiconductor wafer thinning systems and related methods2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (75)· patent assignee history

2021–2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SEMICONDUCTOR COMPONENTS IND LLC	75	2021–2025

Locations

Location	Patents	Span
US	75	2021–2025