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Inventor

Shusaku Tagami

Inventor
Chikuma, JP

Overview

3→
Patents
2007–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
9,738,014'Resin molding machine'20179,238,314'Method for resin molding and resin molding apparatus'20167,175,405'Compression molding machine'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2017Patents assigned to APIC YAMADA CORP (3)· patent assignee history
2007Based in Nagano, JP· patent location history
2016–2017Based in Chikuma, JP· patent location history
2017Patents assigned to FUJISAWA MASAHIKO (1)· patent assignee history
2017Patents assigned to HARAYAMA HIROSHI (1)· patent assignee history
2017Patents assigned to KAWAGUCHI MAKOTO (1)· patent assignee history
2017Patents assigned to KOBAYASHI HIDEMICHI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APIC YAMADA CORP32007–2017
FUJISAWA MASAHIKO12017
HARAYAMA HIROSHI12017
KAWAGUCHI MAKOTO12017
KOBAYASHI HIDEMICHI12017
Locations
LocationPatentsSpan
Chikuma, JP22016–2017
Nagano, JP12007