Inventor
Yuichi Yokoyama
Inventor
Tokyo, JP
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
G03GElectrography9%
H10BElectronic memory devices9%
H10DInorganic electric semiconductor devices7%
B62JCycle saddles or seats6%
G02BOptical elements, systems or apparatus4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
A63FCard, board, or roulette games3%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles3%
B62KCycles3%
PatentTitleYear
D0884748Autonomous lawn mower202010,535,661Integrated memory and integrated assemblies202010,352,546Vehicular headlamp201910,312,241Integrated memory and integrated assemblies201910,160,506Straddle type vehicle201810,046,636Saddle type vehicle20189,939,204Heat spreading module20189,817,188'Pigtail fiber module'20179,746,802'Image forming apparatus and image forming method for forming a transparent toner image and a color image'2017D0788647'Motor tricycle'20179,586,641'Step structure for a saddle-ride vehicle, and vehicle including same'20179,417,546'Image forming apparatus and image forming method for forming a transparent toner image and a color image'20169,278,722'Step structure for saddle-ride type vehicle'20168,822,831'Circuit board'2014D0685295'Auto-unicycle with a safety wheel'20138,305,746'Electronic apparatus'20128,147,331'Video game program, video game device, and video game method'20127,878,890'Game program, game device, and game method'20117,444,106'Fixing member by heating and fixing device in image forming apparatus'20087,239,840'Fixing member by heating and fixing device in image forming apparatus'20076,708,008'Image forming apparatus and image forming method with transfer belt drive unit control'20046,583,461'Semiconductor device and method of manufacturing the same'20036,461,977'Method of manufacturing semiconductor device'20026,444,515'Method of fabricating a semiconductor device'20026,352,343'Gas permeable hard contact lens and method of producing it'20026,249,015'Semiconductor device and fabrication method thereof'20016,033,971'Semiconductor device having an element isolating oxide film and method of manufacturing the same'20005,994,227'Method of manufacturing semiconductor device'19995,905,124'Methods for producing 2-hydroxyethyl methacrylate polymer, hydrogel and water-containing soft contact lens'19995,900,554'Pressure sensor'19995,857,135'Image forming apparatus equipped with pre-transfer drum charger'19995,831,323'Semiconductor device having an element isolating oxide film and method of manufacturing the same'19985,780,870'Semiconductor device and a process of manufacturing the same'19985,747,694'Pressure sensor with barrier in a pressure chamber'19985,747,843'Semiconductor memory device'19985,354,629'Monaqueous electrolyte battery'19944,540,761'Oxygen-permeable hard contact lens'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2003Patents assigned to MITSUBISHI ELECTRIC CORP (9)· patent assignee history
1998–2002Patents assigned to RYODEN SEMICONDUCTOR SYST ENG (5)· patent assignee history
1998–2019Based in Tokyo, JP· patent location history
1998–2002Based in Hyogo, JP· patent location history
1999–2017Patents assigned to TOSHIBA KK (5)· patent assignee history
2004–2017Patents assigned to TOSHIBA TEC KK (5)· patent assignee history
2007–2016Based in Kanagawa, JP· patent location history
2013–2020Patents assigned to HONDA MOTOR CO LTD (7)· patent assignee history
2013–2020Based in Wako, JP· patent location history
2019–2020Based in Boise, ID, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 9 | 1998–2003 |
| HONDA MOTOR CO LTD | 7 | 2013–2020 |
| RYODEN SEMICONDUCTOR SYST ENG | 5 | 1998–2002 |
| TOSHIBA KK | 5 | 1999–2017 |
| TOSHIBA TEC KK | 5 | 2004–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 9 | 1998–2019 |
| Wako, JP | 7 | 2013–2020 |
| Hyogo, JP | 7 | 1998–2002 |
| Kanagawa, JP | 3 | 2007–2016 |
| Boise, ID, US | 2 | 2019–2020 |