Inventor

Kevin Matthew Durocher

Inventor

Waterford, NY, US

Overview

1995–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 64 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

Y10TTechnical subjects covered by former us classification16%

H05KPrinted circuits12%

A61BDiagnosis3%

B81BMicrostructural devices or systems, e.g. micromechanical devices3%

H01LSemiconductor devices3%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%

B29CShaping or joining of plastics2%

H01HElectric switches2%

H10HInorganic light-emitting semiconductor devices having potential barriers2%

PatentTitleYear

10,499,509Methods and systems for a flexible circuit2019 10,068,840Electrical interconnect for an integrated circuit package and method of making same2018 9,679,837'Electrical interconnect for an integrated circuit package and method of making same'2017 9,570,376'Electrical interconnect for an integrated circuit package and method of making same'2017 9,299,647'Electrical interconnect for an integrated circuit package and method of making same'2016 8,904,631'Method of fabricating an interconnect device'2014 8,853,550'Circuit board including mask for controlling flow of solder'2014 8,829,690'System of chip package build-up'2014 8,824,635'Detector modules for imaging systems and methods of manufacturing'2014 8,742,558'Component protection for advanced packaging applications'2014 8,742,646'Ultrasound acoustic assemblies and methods of manufacture'2014 8,653,670'Electrical interconnect for an integrated circuit package and method of making same'2014 8,623,699'Method of chip package build-up'2014 8,498,131'Interconnect structure'2013 8,492,762'Electrical interface for a sensor array'2013 8,466,007'Power semiconductor module and fabrication method'2013 8,405,996'Article including thermal interface element and method of preparation'2013 8,369,671'Hermetically sealed fiber sensing cable'2013 8,331,536'Apparatus for reducing scattered X-ray detection and method of same'2012 8,265,228'Anti-scatter X-ray grid device and method of making same'2012 8,114,708'System and method for pre-patterned embedded chip build-up'2012 8,049,338'Power semiconductor module and fabrication method'2011 8,008,781'Apparatus and method for reducing pitch in an integrated circuit'2011 8,008,125'System and method for stacked die embedded chip build-up'2011 7,964,974'Electronic chip package with reduced contact pad pitch'2011 7,956,457'System and apparatus for venting electronic packages and method of making same'2011 7,952,196'Affordable high performance high frequency multichip module fabrication and apparatus'2011 7,952,187'System and method of forming a wafer scale package'2011 7,919,714'System and a method for controlling flow of solder'2011 7,791,252'Ultrasound probe assembly and method of fabrication'2010 7,781,238'Methods of making and using integrated and testable sensor array'2010 7,727,808'Ultra thin die electronic package'2010 7,517,785'Electronic interconnects and methods of making same'2009 7,427,566'Method of making an electronic device cooling system'2008 7,158,383'Techniques for fabricating a resistor on a flexible base material'2007 6,994,897'Method of processing high-resolution flex circuits with low distortion'2006 6,933,813'Interconnection structure with etch stop'2005 6,790,703'Apparatus for aligning die to interconnect metal on flex substrate'2004 6,773,962'Microelectromechanical system device packaging method'2004 6,767,764'Microelectromechanical system device packaging method'2004 6,733,711'Plastic packaging of LED arrays'2004 6,730,533'Plastic packaging of LED arrays'2004 6,709,944'Techniques for fabricating a resistor on a flexible base material'2004 6,671,948'Interconnection method using an etch stop'2004 6,614,103'Plastic packaging of LED arrays'2003 6,602,739'Method for making multichip module substrates by encapsulating electrical conductors and filling gaps'2003 6,548,329'Amorphous hydrogenated carbon hermetic structure fabrication method'2003 6,475,877'Method for aligning die to interconnect metal on flex substrate'2002 6,429,381'High density interconnect multichip module stack and fabrication method'2002 6,323,096'Method for fabricating a flexible interconnect film with resistor and capacitor layers'2001 6,303,193'Process for fabricating a tool used in electrochemical machining'2001 6,150,719'Amorphous hydrogenated carbon hermetic structure and fabrication method'2000 5,973,908'Structure for thin film capacitors'1999 5,950,303'Method and fixturing to perform two side laminations of stacked substrates forming 3-D modules'1999 5,874,770'Flexible interconnect film including resistor and capacitor layers'1999 5,844,810'Scaled adaptive lithography'1998 5,774,326'Multilayer capacitors using amorphous hydrogenated carbon'1998 5,736,448'Fabrication method for thin film capacitors'1998 5,699,234'Stacking of three dimensional high density interconnect modules with metal edge contacts'1997 5,657,537'Method for fabricating a stack of two dimensional circuit modules'1997 5,652,559'Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby'1997 5,531,018'Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby'1996 5,524,339'Method for protecting gallium arsenide mmic air bridge structures'1996 5,472,539'Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2019Patents assigned to GEN ELECTRIC (59)· patent assignee history

1995–2019Based in Waterford, NY, US· patent location history

2010–2014Patents assigned to DUROCHER KEVIN MATTHEW (15)· patent assignee history

2013–2014Patents assigned to MCCONNELEE PAUL ALAN (4)· patent assignee history

2013–2014Patents assigned to BEAUPRE RICHARD ALFRED (2)· patent assignee history

2013Patents assigned to FILLION RAYMOND ALBERT (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
GEN ELECTRIC	59	1995–2019
DUROCHER KEVIN MATTHEWself	15	2010–2014
MCCONNELEE PAUL ALAN	4	2013–2014
BEAUPRE RICHARD ALFRED	2	2013–2014
FILLION RAYMOND ALBERT	2	2013

Locations

Location	Patents	Span
Waterford, New York, US	64	1995–2019