LexDanaLexDanabeta
Inventor

Takashi Onishi

Inventor
Kobe, JP

Overview

76→
Patents
1981–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 76 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
C23CCoating metallic material6%
Y10TTechnical subjects covered by former us classification6%
G06FElectric digital data processing5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
H01JElectric discharge tubes or discharge lamps5%
H10DInorganic electric semiconductor devices5%
C22CAlloys4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
PatentTitleYear
11,041,266Washing machine202110,821,366Game system, game control device, and information storage medium202010,816,713Surface light source device, display device, and electronic device202010,803,358Information processing device, information processing method, and recording medium202010,683,598Washing machine202010,614,994Electron microscope202010,610,785Game system, game control device, and program202010,489,514Text visualization system, text visualization method, and recording medium201910,409,848Text mining system, text mining method, and program201910,140,361Text mining device, text mining method, and computer-readable recording medium20189,916,302'Text processing using entailment recognition, group generation, and group integration'20189,679,553'Conversation-sentence generation device, conversation-sentence generation method, and conversation-sentence generation program'20179,570,064'Conversation-sentence generation device, conversation-sentence generation method, and conversation-sentence generation program'20179,548,182'Charged particle beam generating apparatus, charged particle beam apparatus, high voltage generating apparatus, and high potential apparatus'20179,542,386'Entailment evaluation device, entailment evaluation method, and recording medium'20179,518,490'Exhaust gas processing device for engine'20169,489,370'Synonym relation determination device, synonym relation determination method, and program thereof'20169,416,704'Exhaust gas treatment device of engine'20169,393,524'Engine exhaust treatment device'20169,353,666'Exhaust treatment device of diesel engine'20169,293,293'Electron gun and charged particle beam device having an aperture with flare-suppressing coating'20169,200,551'Exhaust treatment apparatus for engine'20158,827,812'Game device, game device control method, program, and information storage medium'20148,801,234'Light emitting module and optical wavelength converting member'20148,803,411'Charged particle beam radiation apparatus'20148,786,172'Fluorescent member and light emitting module'20148,763,374'Exhaust gas treatment device for diesel engine'20148,762,132'Textual entailment recognition apparatus, textual entailment recognition method, and computer-readable recording medium'20148,749,128'Fluorescent member and light emitting module'20148,669,535'Electron gun'20148,482,189'Display device'2013D0685820'Internal combustion engine'20138,444,463'Game device, method for controlling game device, program, and information storage medium'20138,382,916'Method for production of steel product with outstanding descalability; and steel wire with outstanding descalability'20138,216,394'Method for production of steel product with outstanding descalability; and steel wire with outstanding descalability'20128,092,916'Steel wire rod'20127,994,503'Cu alloy wiring film, TFT element for flat-panel display using the Cu alloy wiring film, and Cu alloy sputtering target for depositing the Cu alloy wiring film'20117,951,284'Electrolysis apparatus, electrochemical reaction membrane apparatus, porous electrical conductor, and production method thereof'20117,943,019'Insoluble electrode'20117,928,573'Metal thin film for interconnection of semiconductor device'20117,781,339'Method of fabricating semiconductor interconnections'20107,538,027'Fabrication method for semiconductor interconnections'20097,449,692'Charged particle beam apparatus'20087,385,293'Copper alloy, fabrication method thereof, and sputtering target'20087,335,596'Method for fabricating copper-based interconnections for semiconductor device'20087,297,271'Titanium powder sintered compact'20077,284,529'Engine'20077,223,976'Charged particle beam apparatus'20077,208,731'Charged particle beam apparatus'20077,184,163'Image forming system'20077,064,324'Charged particle beam apparatus'20067,022,384'Reflective film, reflection type liquid crystal display, and sputtering target for forming the reflective film'20066,752,840'Denim-like article of clothing and method of producing the same'20046,689,444'REFLECTION LAYER OR SEMI-TRANSPARENT REFLECTION LAYER FOR USE IN OPTICAL INFORMATION RECORDING MEDIA, OPTICAL INFORMATION RECORDING MEDIA AND SPUTTERING TARGET FOR USE IN THE OPTICAL INFORMATION RECORDING MEDIA'20046,539,279'Image forming apparatus for sorting and discharging printed sheets into mail bins'20036,483,601'Image forming apparatus'20026,387,536'A1 alloy thin film for semiconductor device electrode and sputtering target to deposit A1 film by sputtering process for semiconductor device electrode'20026,333,267'Method of manufacturing active matrix type liquid crystal display'20016,215,563'Image reading apparatus for reading images from different kinds of film in accordance with the size and characteristics of the film'20016,206,985'A1 alloy films and melting A1 alloy sputtering targets for depositing A1 alloy films'20016,162,381'Method for producing a molded unit with electrodes embedded therein'20006,152,629'Image forming apparatus'20006,096,438'A1-N1-Y alloy films for electrodes of semiconductor devices and sputtering targets for depositing the A1-N1-Y alloy films'20006,027,792'Coating film excellent in resistance to halogen-containing gas corrosion and halogen-containing plasma corrosion, laminated structure coated with the same, and method for producing the same'20005,976,641'A1 alloy films and melting A1 alloy sputtering targets for depositing A1 alloy films'19995,762,992'Method of preventing a decrease in sweetness of thaumatin'19985,500,301'A1 alloy films and melting A1 alloy sputtering targets for depositing A1 alloy films'19965,389,544'Method for counting living cells of microbes and apparatus therefor'19955,327,206'Image forming apparatus including a sheet refeeding unit'19945,302,181'Oxide-dispersion-strengthened heat-resistant chromium-based sintered alloy'19945,089,848'Abnormal charge and toner density detecting system and method for use in an electrostatic copier'19925,028,958'Copying apparatus with simultaneous multi-color single cycle copying'19915,016,049'Document detecting device for an image forming apparatus'19914,943,883'Quarternary amorphous magnetic alloy thin film and magnetic head including same'19904,383,932'Water removing composition'19834,262,268'Composite pi-section LC filter assembly and method of manufacture'1981

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2020Based in Osaka, JP· patent location history
1994–2016Patents assigned to KUBOTA KK (9)· patent assignee history
1996–2013Patents assigned to KOBE STEEL LTD (19)· patent assignee history
1996–2013Based in Kobe, JP· patent location history
2006–2014Based in Mito, JP· patent location history
2007–2020Patents assigned to HITACHI HIGH TECH CORP (7)· patent assignee history
2007–2016Based in Sakai, JP· patent location history
2012–2016Patents assigned to ONISHI TAKASHI (14)· patent assignee history
2014–2020Patents assigned to NEC CORP (10)· patent assignee history
2014–2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KOBE STEEL LTD191996–2013
ONISHI TAKASHIself142012–2016
NEC CORP102014–2020
KUBOTA KK91994–2016
HITACHI HIGH TECH CORP72007–2020
Locations
LocationPatentsSpan
Kobe, JP191996–2013
Tokyo, JP182014–2021
Sakai, JP72007–2016
Osaka, JP61991–2020
Mito, JP62006–2014