Inventor
Ming-Hsun Li
Inventor
Tainan, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
G06FElectric digital data processing18%
G06VImage or video recognition or understanding18%
H05KPrinted circuits18%
H04LTransmission of digital information, e.g. telegraphic communication9%
PatentTitleYear
10,218,767Method, system and browser for executing active object of browser20199,996,512Customized processing of DOM objects20188,253,235'Semiconductor packaging substrate improving capability of electrostatic dissipation'20127,936,032'Film type package for fingerprint sensor'20117,812,422'Film type package for fingerprint sensor'20107,732,911'Semiconductor packaging substrate improving capability of electrostatic dissipation'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2012Patents assigned to CHIPMOS TECHNOLOGIES INC (4)· patent assignee history
2010–2012Based in Tainan, TW· patent location history
2011Patents assigned to CHIPMOS TECHNOLOGIES BERMUDA (1)· patent assignee history
2012Patents assigned to CHEN TSUNG LUNG (1)· patent assignee history
2012Patents assigned to LI MING HSUN (1)· patent assignee history
2018–2019Patents assigned to BEIJING QIHOO TECHNOLOGY CO (2)· patent assignee history
2018–2019Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHIPMOS TECHNOLOGIES INC | 4 | 2010–2012 |
| BEIJING QIHOO TECHNOLOGY CO | 2 | 2018–2019 |
| CHEN TSUNG LUNG | 1 | 2012 |
| CHIPMOS TECHNOLOGIES BERMUDA | 1 | 2011 |
| LI MING HSUNself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 4 | 2010–2012 |
| Beijing, CN | 2 | 2018–2019 |