Inventor
Ke Ke Cai
Inventor
Beijing, CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing15%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry8%
B22FWorking metallic powder8%
C01BNon-metallic elements8%
C01FCompounds of the metals beryllium, magnesium, aluminium, calcium, strontium, barium, radium, thorium, or of the rare-earth metals8%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds8%
C04BLime, magnesia8%
C09CTreatment of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties8%
G06NComputing arrangements based on specific computational models8%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes8%
PatentTitleYear
10,997,228Comparing tables with semantic vectors202110,956,915Conformity determination of cross-regional affairs202110,902,205Facilitating automatic detection of relationships between sentences in conversations20218,845,936'Process and device for the preparation of hollow microspheres comprising centrifugal atomization'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014Patents assigned to CAI KAI (1)· patent assignee history
2014Patents assigned to GE GUOJUN (1)· patent assignee history
2014Patents assigned to HEBEI YL BANGDA NEW MATERIALS LTD COMPANY (1)· patent assignee history
2014Patents assigned to HUANG YONG (1)· patent assignee history
2014–2021Based in Beijing, CN· patent location history
2021Patents assigned to IBM (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 3 | 2021 |
| CAI KAIself | 1 | 2014 |
| GE GUOJUN | 1 | 2014 |
| HEBEI YL BANGDA NEW MATERIALS LTD COMPANY | 1 | 2014 |
| HUANG YONG | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 4 | 2014–2021 |