Inventor
Kazumi Nakayoshi
Inventor
Chiba, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Lprimary
C08LCompositions of macromolecular compounds20%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
C09JAdhesives11%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients9%
Y10TTechnical subjects covered by former us classification7%
H01BCables4%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
C10MLubricating compositions2%
C10NIndexing scheme associated with subclass c10m relating to lubricating compositions2%
PatentTitleYear
8,912,132'Thermally conductive silicone grease composition'20148,796,190'Thermally conductive silicone grease composition'20148,633,276'Thermally conductive silicone composition and electronic device'20148,546,508'Sealant or filler for electrical and electronic components, and electrical and electrical components'20137,700,678'Silver-based powder, method of preparation thereof, and curable silicone composition'20107,537,712'Electrically conductive silicone rubber composition'20097,375,158'Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition'20087,074,849'Silver-filled electrically conductive organosiloxane compositions'20067,056,129'Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices'20066,797,772'Alkenyl polyorganosiloxane, organohydrogensiloxane, organosilicon or silane treated silver particles and Pt catalyst'20046,518,204'Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition'20036,513,680'Paste dispensing container'20036,369,185'Curable organopolysiloxane composition, cured products formed therefrom and unified articles'20026,039,831'Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices'20006,040,362'Heat-conducting polymer composition'20006,017,587'Electrically conductive silicone compositions'20005,982,041'Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices'19995,932,145'Addition reaction-curing electrically conductive silicone composition and method for the preparation thereof'19995,872,170'Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices'19995,804,631'Curable organosiloxane compositions and semiconductor devices'19985,173,765'Conductive adhesive and article made therewith'19925,145,931'Semiconductor pellet adhesive and article made therewith'19925,036,024'Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation'19914,721,994'Lead frame for semiconductor devices'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–2010Based in Chiba, JP· patent location history
1991Based in Ichihara, JP· patent location history
1992–2009Patents assigned to DOW CORNING TORAY SILICONE (15)· patent assignee history
2000–2006Patents assigned to DOW CORNING (2)· patent assignee history
2010–2014Patents assigned to DOW CORNING TORAY CO LTD (5)· patent assignee history
2013–2014Patents assigned to NAKAYOSHI KAZUMI (4)· patent assignee history
2013–2014Based in Sodegaura, JP· patent location history
2014Patents assigned to KATO TOMOKO (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DOW CORNING TORAY SILICONE | 15 | 1992–2009 |
| DOW CORNING TORAY CO LTD | 5 | 2010–2014 |
| NAKAYOSHI KAZUMIself | 4 | 2013–2014 |
| KATO TOMOKO | 3 | 2014 |
| DOW CORNING | 2 | 2000–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chiba, JP | 19 | 1988–2010 |
| Sodegaura, JP | 4 | 2013–2014 |
| Ichihara, JP | 1 | 1991 |