Inventor
Jun-feng LU
Inventor
CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01JElectric discharge tubes or discharge lamps14%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
12,347,687Etch rate modulation of FinFET through high-temperature ion implantation202511,942,324Method for BEOL metal to dielectric adhesion202411,875,995Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation202411,201,057Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to APPLIED MATERIALS INC (4)· patent assignee history
2021–2025Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 4 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 4 | 2021–2025 |