Inventor
Robert Yi
Inventor
San Jose, CA, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus50%
H10DInorganic electric semiconductor devices11%
Y10TTechnical subjects covered by former us classification11%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
H01RElectrically-conductive connections7%
H05KPrinted circuits7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
PatentTitleYear
9,383,519'Optical communication module with fiber submount and latching optics assembly'20169,176,289'Pluggable data communication module with compliant push-pull tab'20158,790,022'Pluggable data communication module with slider-crank delatch mechanism'20148,517,616'Optoelectronic module having an adapter for use in extracting the module from a cage'20138,500,342'Opto-electronic communication module having retainer for aligning optical ports'20138,485,739'Optical transceiver module having a deformable heat sink structure'20138,467,190'Balanced cooling system and method for high-density stacked cages'20138,308,377'Delatch device having both push and pull operability for use with an optical transceiver module, and a method'20128,244,081'Passive alignment using elastic averaging in optoelectronics applications'20127,764,853'Passive alignment using elastic averaging in optoelectronics applications'20107,473,039'Axis translation installation mechanism for optoelectronics modules and method'20097,454,105'Passive alignment using elastic averaging in optoelectronics applications'20087,255,495'Axis translation installation mechanism for optoelectronic modules'20077,233,723'Optoelectronic assembly with coupling features for alignment'20077,202,553'Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging'20077,176,106'Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2012Patents assigned to AVAGO TECH FIBER IP SG PTE LTD (9)· patent assignee history
2007–2016Based in San Jose, CA, US· patent location history
2007Based in Palo Alto, CA, US· patent location history
2012–2013Patents assigned to YI ROBERT (5)· patent assignee history
2012Patents assigned to BAUGH BRENTON A (1)· patent assignee history
2013–2016Patents assigned to AVAGO TECHNOLOGIES GENERAL IP (7)· patent assignee history
2013Patents assigned to YU PAUL (3)· patent assignee history
2013Based in Santa Clara, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVAGO TECH FIBER IP SG PTE LTD | 9 | 2007–2012 |
| AVAGO TECHNOLOGIES GENERAL IP | 7 | 2013–2016 |
| YI ROBERTself | 5 | 2012–2013 |
| YU PAUL | 3 | 2013 |
| BAUGH BRENTON A | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 13 | 2007–2016 |
| Palo Alto, California, US | 2 | 2007 |
| Santa Clara, California, US | 1 | 2013 |