Inventor
Tay Liang Chee
Inventor
Singapore, SG
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics75%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
6,514,797'Underfill applications using film technology'20035,965,078'Method for manufacturing prepackaged molding compound for component encapsulation'19995,888,443'Method for manufacturing prepackaged molding compound for component encapsulation'19995,885,506'Pre-packaged molding for component encapsulation'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999Patents assigned to TEXAS INSTRUMENTS INC (3)· patent assignee history
1999–2003Based in Singapore, SG· patent location history
2003Patents assigned to MICRON TECHNOLOGY INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 3 | 1999 |
| MICRON TECHNOLOGY INC | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 4 | 1999–2003 |