Inventor
Jen-Kuang Fang
Inventor
Pingtung County, TW
Overview
Patents· 50 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%
H01LSemiconductor devices9%
H05KPrinted circuits9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B23KSoldering or unsoldering6%
G01RMeasuring electric variables2%
G06FElectric digital data processing2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
Y10TTechnical subjects covered by former us classification2%
C23FNon-mechanical removal of metallic material from surface1%
PatentTitleYear
11,024,753PERC solar cell capable of improving photoelectric conversion efficiency and preparation method thereof202110,984,588Obstacle distribution simulation method and device based on multiple models, and storage medium202110,951,557Information interaction method and terminal202110,818,636Substrate panel structure and manufacturing process202010,685,934Semiconductor package device and method of manufacturing the same202010,672,696Semiconductor device package202010,636,745Semiconductor package device and method of manufacturing the same202010,566,279Package device, semiconductor device, and method for manufacturing the package device202010,269,672Semiconductor package device and method of manufacturing the same201910,224,301Semiconductor package device and method of manufacturing the same20199,748,196'Semiconductor package structure including die and substrate electrically connected through conductive segments'20177,726,544'Method of packaging flip chip and method of forming pre-solders on substrate thereof'20107,635,610'Multi-chip stack package and fabricating method thereof'20097,384,566'Fabrication method for printed circuit board'20087,375,020'Method of forming bumps'20087,262,497'Bumpless assembly package'20077,064,428'Wafer-level package structure'20067,041,534'Semiconductor chip package and method for making the same'20066,989,326'Bump manufacturing method'20066,972,583'Method for testing electrical characteristics of bumps'20056,967,153'Bump fabrication process'20056,933,616'Multi-chip module packaging device using flip-chip bonding technology'20056,927,964'Structure for preventing burnt fuse pad from further electrical connection'20056,924,557'Semiconductor package'20056,916,732'Method of forming bumps'20056,877,653'Method of modifying tin to lead ratio in tin-lead bump'20056,878,963'Device for testing electrical characteristics of chips'20056,875,683'Method of forming bump'20056,861,346'Solder ball fabricating process'20056,846,719'Process for fabricating wafer bumps'20056,838,311'Flip chip package and method for forming the same'20056,827,252'Bump manufacturing method'20046,820,329'Method of manufacturing multi-chip stacking package'20046,756,256'Method for preventing burnt fuse pad from further electrical connection'20046,743,707'Bump fabrication process'20046,737,353'Semiconductor device having bump electrodes'20046,732,912'Solder ball attaching process'20046,723,630'Solder ball fabrication process'20046,720,244'Bump fabrication method'20046,716,739'Bump manufacturing method'20046,713,320'Bumping process'20046,713,870'Wafer level chip-scale package'20046,692,581'Solder paste for fabricating bump'20046,673,711'Solder ball fabricating process'20046,664,128'Bump fabrication process'20036,617,237'Lead-free bump fabrication process'20036,469,399'Semiconductor package'20026,342,443'Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate'20026,153,939'Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same'20006,150,730'Chip-scale semiconductor package'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (46)· patent assignee history
2000–2010Based in Pingtung County, TW· patent location history
2002–2005Based in Hsin Chu Hsien, TW· patent location history
2004–2020Based in Kaohsiung, TW· patent location history
2004–2005Based in Kaoshiung, TW· patent location history
2009Patents assigned to ADAVNACED SEMICONDUCTOR ENGINE (1)· patent assignee history
2021Patents assigned to Baidu online network technology beijing co ltd (1)· patent assignee history
2021Patents assigned to GUANGDONG AIKO SOLAR ENERGY TECHNOLOGY CO LTD (1)· patent assignee history
2021Patents assigned to TENCENT TECH SHENZHEN CO LTD (1)· patent assignee history
2021Based in Foshan, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 46 | 2000–2020 |
| ADAVNACED SEMICONDUCTOR ENGINE | 1 | 2009 |
| Baidu online network technology beijing co ltd | 1 | 2021 |
| GUANGDONG AIKO SOLAR ENERGY TECHNOLOGY CO LTD | 1 | 2021 |
| TENCENT TECH SHENZHEN CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pingtung County, TW | 29 | 2000–2010 |
| Kaohsiung, TW | 10 | 2004–2020 |
| Kaoshiung, TW | 5 | 2004–2005 |
| Hsin Chu Hsien, TW | 3 | 2002–2005 |
| Foshan, CN | 1 | 2021 |