Inventor
Walter M. Marcinkiewicz
Inventor
Apex, NC, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H05KPrinted circuits16%
H04MTelephonic communication9%
H04NPictorial communication, e.g. television9%
H04LTransmission of digital information, e.g. telegraphic communication7%
H01QAntennas, i.e. radio aerials5%
H01RElectrically-conductive connections5%
H04WWireless communication networks5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
F16FSprings2%
PatentTitleYear
9,509,867'Methods and apparatus for collecting image data'20169,009,210'Distribution of multimedia files using a transportation provider wireless device'20158,583,164'Reward-based access to media content'20138,145,004'System and method for generating a photograph'20128,130,235'Apparatus and method of automatically adjusting a display experiencing varying lighting conditions'20128,045,799'System and method for generating a photograph with variable image quality'20117,922,523'Vertically stackable sockets for chip modules'20117,292,872'Mobile phone push-to-talk voice activation'20077,210,860'Electronic devices including fiber optic cable and methods for forming the same'20076,840,796'Portable electronic devices with a flexible connection between internal electronics and an auxiliary connection'20056,570,776'Shielded electronics package structure with enhanced mechanical reliability'20036,538,196'Electric module structure formed with a polymer shrunk material'20036,195,267'Gel structure for combined EMI shielding and thermal control of microelectronic assemblies'20016,061,036'Rigid and flexible antenna'20006,046,708'Termination contact for an antenna with a nickel-titanium radiating element'20006,025,995'Integrated circuit module and method'20006,001,673'Methods for packaging integrated circuit devices including cavities adjacent active regions'19995,914,864'Shock and vibration attenuating structure for an electronic assembly'19995,905,638'Method and apparatus for packaging a microelectronic device with an elastomer gel'19995,885,710'Flexible strip transmission line'19995,422,513'Integrated circuit chip placement in a high density interconnect structure'19955,241,456'Compact high density interconnect structure'19935,157,255'Compact, thermally efficient focal plane array and testing and repair thereof'19925,146,303'Compact, thermally efficient focal plane array and testing and repair thereof'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–1993Patents assigned to GEN ELECTRIC (3)· patent assignee history
1992–1993Based in Schenectady, NY, US· patent location history
1995Based in Niskayuna, NY, US· patent location history
1999–2003Patents assigned to ERICSSON INC (6)· patent assignee history
1999Patents assigned to ERICSSON GE MOBILE INC (3)· patent assignee history
1999–2007Based in Apex, NC, US· patent location history
2005–2012Patents assigned to SONY ERICSSON MOBILE COMM AB (6)· patent assignee history
2007–2016Based in Chapel Hill, NC, US· patent location history
2012–2016Patents assigned to MARCINKIEWICZ WALTER M (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ERICSSON INC | 6 | 1999–2003 |
| SONY ERICSSON MOBILE COMM AB | 6 | 2005–2012 |
| MARCINKIEWICZ WALTER Mself | 4 | 2012–2016 |
| ERICSSON GE MOBILE INC | 3 | 1999 |
| GEN ELECTRIC | 3 | 1992–1993 |
Locations
| Location | Patents | Span |
|---|---|---|
| Apex, NC, US | 12 | 1999–2007 |
| Chapel Hill, NC, US | 8 | 2007–2016 |
| Schenectady, New York, US | 3 | 1992–1993 |
| Niskayuna, New York, US | 1 | 1995 |