Inventor
SUBAL SAHNI
Inventor
US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus25%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein21%
H04BTransmission14%
G01KMeasuring temperature13%
H01LSemiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H10BElectronic memory devices3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
H10DInorganic electric semiconductor devices1%
PatentTitleYear
12,564,047Thermal control of an optical component202612,494,403Preserving access to optical components on a wafer package with sacrificial die202512,468,103Optically bridged multicomponent package with extended temperature range202512,443,000Optically bridged multicomponent package with extended temperature range202512,442,997Optically bridged multicomponent package with extended temperature range202512,442,998Optically bridged multicomponent package with extended temperature range202512,442,999Optically bridged multicomponent package with extended temperature range202512,436,346Optically bridged multicomponent package with extended temperature range202512,405,434Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute202512,401,006Electrical interconnects for packages containing photonic integrated circuits202512,399,333Optical multi-die interconnect bridge with electrical and optical interfaces202512,401,007Electrical interconnects for packages containing photonic integrated circuits202512,401,008Electrical interconnects for packages containing photonic integrated circuits202512,401,009Electrical interconnects for packages containing photonic integrated circuits202512,392,974Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute202512,306,437Temperature-stabilized integrated waveguides202512,298,608Optically bridged multicomponent package with extended temperature range202512,242,122Multicomponent photonically intra-die bridged assembly202512,216,318Optical bridging element for separately stacked electrical ICs202512,197,023Manufacturing optically accessible co-packaged optics202512,189,198Manufacturing optically accessible co-packaged optics202512,164,162Multicomponent photonically bridged assembly202412,164,161Stacked-dies optically bridged multicomponent package202412,160,273Multi-protocol optical device202412,124,095Optical multi-die interconnect bridge with optical interface202411,860,412Temperature-stabilized integrated waveguides202411,835,777Optical multi-die interconnect bridge (OMIB)202311,796,888Method and system for a vertical junction high-speed phase modulator202311,735,574Method and system for selectively illuminated integrated photodetectors with configured launching and adaptive junction profile for bandwidth improvement202311,217,710Method and system for germanium-on-silicon photodetectors without germanium layer contacts2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to LUXTERA LLC (3)· patent assignee history
2022–2026Based in US· patent location history
2023–2026Patents assigned to CELESTIAL AI INC (24)· patent assignee history
2023–2025Patents assigned to CISCO TECH INC (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CELESTIAL AI INC | 24 | 2023–2026 |
| CISCO TECH INC | 5 | 2023–2025 |
| LUXTERA LLC | 3 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 30 | 2022–2026 |