Inventor
CHIEN-KEE PANG
Inventor
SG
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01LSemiconductor devices23%
H10DInorganic electric semiconductor devices14%
G01NInvestigating or analysing materials by determining their chemical or physical properties9%
PatentTitleYear
12,419,081Silicon-on-insulator substrate and method of manufacturing the same202512,278,210Manufacturing method of semiconductor structure202512,266,578Chips bonding auxiliary structure202512,249,607Semiconductor structure202511,605,648Semiconductor structure and manufacturing method thereof202311,456,221Method for measuring chips bonding strength and chips bonding auxiliary structure2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to UNITED MICROELECTRONICS CORP (6)· patent assignee history
2022–2025Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 6 | 2022–2025 |