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Inventor

Aik Chong Tan

Inventor
Johor Bahru, MY

Overview

3→
Patents
2002–2005
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
6,864,423'Bump chip lead frame and package'20056,392,288'Lead frame for assembly for thin small outline plastic encapsulated packages'20026,376,266'Semiconductor package and method for forming same'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Patents assigned to SEMICONDUCTOR COMPONENTS IND (2)· patent assignee history
2002–2005Based in Johor Bahru, MY· patent location history
2005Patents assigned to SEMICONDUCTOR COMPONENT IND L (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEMICONDUCTOR COMPONENTS IND22002
SEMICONDUCTOR COMPONENT IND L12005
Locations
LocationPatentsSpan
Johor Bahru, MY32002–2005