LexDanaLexDanabeta
Inventor

YOUNG DOO JEON

Inventor
KR

Overview

4→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10DInorganic electric semiconductor devices20%
PatentTitleYear
11,935,952Semiconductor devices202411,908,819Semiconductor packaging substrate fine pitch metal bump and reinforcement structures202411,545,455Semiconductor packaging substrate fine pitch metal bump and reinforcement structures202311,469,325Semiconductor devices2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2022–2024Based in KR· patent location history
2023–2024Patents assigned to APPLE INC (2)· patent assignee history
2023–2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLE INC22023–2024
SAMSUNG ELECTRONICS CO LTD22022–2024
Locations
LocationPatentsSpan
KR22022–2024
US22023–2024