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Inventor

Hyuek-Jae Lee

Inventor
Hwaseong-si, KR

Overview

2→
Patents
2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B05Dprimary
B05DProcesses for applying fluent materials to surfaces, in general14%
C23CCoating metallic material14%
G11CStatic stores14%
H01LSemiconductor devices14%
H05KPrinted circuits14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
PatentTitleYear
11,018,026Interposer, semiconductor package, and method of fabricating interposer202110,984,844Apparatuses and methods for determining a phase relationship between an input clock signal and a multiphase clock signal2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to MICRON TECHNOLOGY INC (1)· patent assignee history
2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
2021Based in Hwaseong-si, KR· patent location history
2021Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC12021
SAMSUNG ELECTRONICS CO LTD12021
Locations
LocationPatentsSpan
Hwaseong-si, KR12021
Boise, ID, US12021