Inventor
KAO-CHIH LIU
Inventor
TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables24%
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
B82YSpecific uses or applications of nanostructures6%
H05KPrinted circuits6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
12,553,939Interconnect structures in integrated circuit chips202612,532,720Forming openings through carrier substrate of IC package assembly for fault identification202612,265,119Repackaging IC chip for fault identification202512,219,709Forming trench in IC chip through multiple trench formation and deposition processes2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2025–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 4 | 2025–2026 |