Inventor
Leo A. Merilo
Inventor
Singapore, SG
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1092%
H01LSemiconductor devices8%
PatentTitleYear
9,281,300'Chip scale module package in BGA semiconductor package'20168,395,254'Integrated circuit package system with heatspreader'20138,138,080'Integrated circuit package system having interconnect stack and external interconnect'20128,097,935'Quad flat package'20128,097,496'Method of forming quad flat package'20128,026,129'Stacked integrated circuits package system with passive components'20117,786,575'Stacked die semiconductor device having circuit tape'20107,687,892'Quad flat package'20107,659,608'Stacked die semiconductor device having circuit tape'20107,439,620'Integrated circuit package-in-package system'20086,875,634'Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same'20056,737,298'Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2016Based in Singapore, SG· patent location history
2008–2016Patents assigned to STATS CHIPPAC LTD (10)· patent assignee history
2012–2016Patents assigned to FILOTEO JR DARIO S (5)· patent assignee history
2012–2016Patents assigned to MERILO LEO A (5)· patent assignee history
2012–2016Patents assigned to ABINAN RACHEL L (3)· patent assignee history
2012–2016Patents assigned to ESPIRITU EMMANUEL A (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 10 | 2008–2016 |
| FILOTEO JR DARIO S | 5 | 2012–2016 |
| MERILO LEO Aself | 5 | 2012–2016 |
| ABINAN RACHEL L | 3 | 2012–2016 |
| ESPIRITU EMMANUEL A | 3 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 12 | 2004–2016 |