Inventor
WOON KAB JUNG
Inventor
KR
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,107,035Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate202411,488,892Methods and structures for increasing the allowable die size in TMV packages202211,430,723Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (3)· patent assignee history
2022Patents assigned to AMKOR TECHNOLOGY INC (1)· patent assignee history
2022–2024Based in KR· patent location history
2024Patents assigned to AMKOR TECH SINGAPORE HOLDINGS PTE LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 3 | 2022–2024 |
| AMKOR TECH SINGAPORE HOLDINGS PTE LTD | 1 | 2024 |
| AMKOR TECHNOLOGY INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 3 | 2022–2024 |