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Inventor

CHEE-KEONG CHONG

Inventor
US

Overview

3→
Patents
2022–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics22%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering22%
G06FElectric digital data processing22%
G06TImage data processing or generation, in general22%
B29LIndexing scheme associated with subclass b29c, relating to particular articles11%
PatentTitleYear
12,109,735Construction of conformal cooling channels for injection mold designs202411,663,372Spatially-aware detection of trapped support areas in 3D printing202311,270,049Internal channel network detections for 3D printing2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to SIEMENS IND SOFTWARE INC (3)· patent assignee history
2022Patents assigned to CHONG CHEE KEONG (1)· patent assignee history
2022Patents assigned to HE XUEQIN (1)· patent assignee history
2022Patents assigned to LI ZHI (1)· patent assignee history
2022Patents assigned to TANG SHENG DER (1)· patent assignee history
2022–2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SIEMENS IND SOFTWARE INC32022–2024
CHONG CHEE KEONGself12022
HE XUEQIN12022
LI ZHI12022
TANG SHENG DER12022
Locations
LocationPatentsSpan
US32022–2024