Inventor
ERICH GRIEBL
Inventor
DE
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10DInorganic electric semiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
G06FElectric digital data processing6%
PatentTitleYear
11,949,006Power semiconductor device with p-contact and doped insulation blocks defining contact holes202411,888,061Power semiconductor device having elevated source regions and recessed body regions202411,610,986Power semiconductor switch having a cross-trench structure202311,515,264Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer202211,469,317RC IGBT202211,257,946Method of forming a power semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INFINEON TECH DRESDEN GMBH & CO KG (4)· patent assignee history
2022–2023Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
2022Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (1)· patent assignee history
2022–2024Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECH DRESDEN GMBH & CO KG | 4 | 2022–2024 |
| INFINEON TECHNOLOGIES AG | 2 | 2022–2023 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 6 | 2022–2024 |