Inventor
Yasushi Washio
Inventor
Kawasaki, JP
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices42%
H05KPrinted circuits12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
B23BTurning8%
B26FPerforating8%
Y10TTechnical subjects covered by former us classification8%
B05DProcesses for applying fluent materials to surfaces, in general4%
H01JElectric discharge tubes or discharge lamps4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
9,557,651'Chemically amplified positive-type photosensitive resin composition'20179,244,354'Method for producing thick film photoresist pattern'20169,091,916'Positive-type photoresist composition, photoresist laminate, method for producing photoresist pattern, and method for producing connecting terminal'20158,507,180'Chemically amplified positive-type photoresist composition for thick film, chemically amplified dry film for thick film, and method for production of thick film resist pattern'20138,455,058'Resin composition and coating method using the same'20138,105,763'Method of forming plated product using negative photoresist composition and photosensitive composition used therein'20127,879,525'Chemically amplified photoresist composition, laminated product, and connection element'20117,846,640'Developer composition for resists and method for formation of resist pattern'20107,598,014'Thick film photoresist composition and method of forming resist pattern'20097,335,465'Developer composition for resists and method for formation of resist pattern'20086,838,229'Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same'20056,214,135'Entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board'20016,000,886'Entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2001Patents assigned to SHOWA ALUMINUM CORP (2)· patent assignee history
1999–2001Based in Tokyo, JP· patent location history
2005–2017Patents assigned to TOKYO OHKA KOGYO CO LTD (11)· patent assignee history
2005–2015Based in Kanagawa, JP· patent location history
2008–2017Based in Kawasaki, JP· patent location history
2012–2013Patents assigned to WASHIO YASUSHI (3)· patent assignee history
2012–2013Patents assigned to SAITO KOJI (2)· patent assignee history
2013Patents assigned to SENZAKI TAKAHIRO (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO OHKA KOGYO CO LTD | 11 | 2005–2017 |
| WASHIO YASUSHIself | 3 | 2012–2013 |
| SAITO KOJI | 2 | 2012–2013 |
| SENZAKI TAKAHIRO | 2 | 2013 |
| SHOWA ALUMINUM CORP | 2 | 1999–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 8 | 2008–2017 |
| Kanagawa, JP | 3 | 2005–2015 |
| Tokyo, JP | 2 | 1999–2001 |