Inventor

Chieh-Lung Lai

Inventor

Taichung, TW

Overview

16→

Patents

2006–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%

H01LSemiconductor devices21%

F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted10%

H10HInorganic light-emitting semiconductor devices having potential barriers10%

F21SNon-portable lighting devices7%

F21VFunctional features or details of lighting devices or systems thereof7%

F21KNon-electric light sources using luminescence5%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

B24BMachines, devices, or processes for grinding or polishing2%

G02BOptical elements, systems or apparatus2%

PatentTitleYear

10,679,914Electronic package and method for manufacturing the same2020 10,403,596Method of fabricating packaging structure2019 10,403,570Method for fabricating electronic package2019 10,128,178Electronic package and method for fabricating the same2018 9,899,309'Electronic package and semiconductor substrate'2018 9,831,191Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package2017 9,515,039'Substrate structure with first and second conductive bumps having different widths'2016 9,502,335'Package structure and method for fabricating the same'2016 8,716,737'Die-bonded LED'2014 8,471,284'LED package structure and fabrication method thereof'2013 8,236,687'Die-bonding method of LED chip and LED manufactured by the same'2012 8,235,551'LED module and packaging method thereof'2012 7,717,587'Light source device'2010 7,575,344'Lamp fixture'2009 7,530,712'Reflective illumination device'2009 7,001,248'Fine tilting adjustment mechanism for grinding machine'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2014Patents assigned to IND TECH RES INST (7)· patent assignee history

2006–2020Based in Taichung, TW· patent location history

2009Based in Taiping, TW· patent location history

2010Based in Hsinchu County, TW· patent location history

2012–2013Patents assigned to LAI CHIEH-LUNG (3)· patent assignee history

2012Patents assigned to LIN HSIU-JEN (2)· patent assignee history

2012Patents assigned to LIN JIAN-SHIAN (2)· patent assignee history

2012–2014Based in Hsinchu, TW· patent location history

2013–2020Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (9)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SILICONWARE PRECISION INDUSTRIES CO LTD	9	2013–2020
IND TECH RES INST	7	2006–2014
LAI CHIEH-LUNGself	3	2012–2013
LIN HSIU-JEN	2	2012
LIN JIAN-SHIAN	2	2012

Locations

Location	Patents	Span
Taichung, TW	12	2006–2020
Hsinchu, TW	2	2012–2014
Hsinchu County, TW	1	2010
Taiping, TW	1	2009