Inventor
Ting-wei WU
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices8%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
A45CPurses4%
G01SRadio direction-finding4%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them4%
G06FElectric digital data processing4%
G06KGraphical data reading4%
G06TImage data processing or generation, in general4%
G06VImage or video recognition or understanding4%
PatentTitleYear
12,106,964Double-patterning method to improve sidewall uniformity2024D1019739Camera202411,800,304Behind-the-ear hearing assistance device202311,653,732Receiving box for hearing assistance device202311,438,992Non-common-ground bandpass filter circuit with electrostatic discharge protection202211,385,720Picture selection method of projection touch202211,335,568Method for forming semiconductor structure202211,246,010Method and system for positioning and tracking using a plurality of sensors2022D0940948Projector with lamp2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to COMPAL ELECTRONICS INC (5)· patent assignee history
2022–2024Patents assigned to WU TING WEI (4)· patent assignee history
2022Patents assigned to IWAVE TECH CO LTD (2)· patent assignee history
2022–2024Based in TW· patent location history
2023Patents assigned to HSU WEI CHIH (2)· patent assignee history
2023Patents assigned to TSAI DAI YUN (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| COMPAL ELECTRONICS INC | 5 | 2022–2024 |
| WU TING WEIself | 4 | 2022–2024 |
| HSU WEI CHIH | 2 | 2023 |
| IWAVE TECH CO LTD | 2 | 2022 |
| TSAI DAI YUN | 2 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2024 |