Inventor

David W. Sherrer

Inventor

Radford, VA, US

Overview

2001–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 112 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G02Bprimary

G02BOptical elements, systems or apparatus23%

H01PWaveguides14%

Y10TTechnical subjects covered by former us classification10%

H05KPrinted circuits9%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%

H01LSemiconductor devices4%

H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light4%

B81BMicrostructural devices or systems, e.g. micromechanical devices4%

G01BMeasuring length, thickness or similar linear dimensions4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

PatentTitleYear

10,497,511Multilayer build processes and devices thereof2019 10,431,521Integrated electronic components and methods of formation thereof2019 10,361,471Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems2019 10,305,158Three-dimensional microstructures2019 10,257,951Substrate-free interconnected electronic mechanical structural systems2019 10,193,203Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems2019 10,135,109Method of forming a coaxial line microstructure having an enlarged region on a substrate and removing the coaxial line microstructure from the substrate for mounting on a mounting substrate2018 10,074,885Coaxial waveguide microstructures having conductors formed by plural conductive layers2018 10,076,042Devices and methods for solder flow control in three-dimensional microstructures2018 10,002,818Integrated electronic components and methods of formation thereof2018 9,993,982Methods of fabricating electronic and mechanical structures2018 9,888,600'Substrate-free interconnected electronic mechanical structural systems'2018 9,843,084'Three-dimensional microstructures'2017 9,817,199'Device package and methods for the fabrication and testing thereof'2017 9,647,420'Package and methods for the fabrication and testing thereof'2017 9,583,856'Batch fabricated microconnectors'2017 9,570,787'Hollow core coaxial cables and methods of making the same'2017 9,570,789'Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof'2017 9,515,364'Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume'2016 9,505,613'Devices and methods for solder flow control in three-dimensional microstructures'2016 9,490,517'High frequency power combiner/divider'2016 9,413,052'Three-dimensional microstructures'2016 9,410,799'Device package and methods for the fabrication and testing thereof'2016 9,337,152'Formulation for packaging an electronic device and assemblies made therefrom'2016 9,312,589'Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section'2016 9,306,255'Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other'2016 9,306,254'Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration'2016 9,136,575'Three-dimensional microstructures'2015 9,088,074'Hollow core coaxial cables and methods of making the same'2015 9,065,163'High frequency power combiner/divider'2015 9,024,417'Integrated electronic components and methods of formation thereof'2015 9,000,863'Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof'2015 8,993,450'Device package and methods for the fabrication and testing thereof'2015 8,969,132'Device package and methods for the fabrication thereof'2015 8,933,769'Three-dimensional microstructures having a re-entrant shape aperture and methods of formation'2015 8,917,150'Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels'2014 8,866,300'Devices and methods for solder flow control in three-dimensional microstructures'2014 8,814,601'Batch fabricated microconnectors'2014 8,742,874'Coaxial waveguide microstructures having an active device and methods of formation thereof'2014 8,717,124'Thermal management'2014 8,703,603'Device package and methods for the fabrication and testing thereof'2014 8,698,577'Three-dimensional microstructures'2014 8,659,371'Three-dimensional matrix structure for defining a coaxial transmission line channel'2014 8,542,079'Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector'2013 8,399,897'Optical device package'2013 8,309,908'Optoelectronic component including optoelectronic device flip-chip mounted to substrate and conductor extending through the substrate'2012 8,203,207'Electronic device packages and methods of formation'2012 8,049,161'Optoelectronic component with flip-chip mounted optoelectronic device'2011 8,031,037'Three-dimensional microstructures and methods of formation thereof'2011 7,948,335'Coaxial waveguide microstructure having conductive and insulation materials defining voids therein'2011 7,898,356'Coaxial transmission line microstructures and methods of formation thereof'2011 7,888,793'Device package and methods for the fabrication and testing thereof'2011 7,781,727'Optoelectronic component comprising an encapsulant'2010 7,656,256'Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof'2010 7,649,432'Three-dimensional microstructures having an embedded and mechanically locked support member and method of formation thereof'2010 7,508,065'Device package and methods for the fabrication and testing thereof'2009 7,449,784'Device package and methods for the fabrication and testing thereof'2008 7,405,638'Coaxial waveguide microstructures having an active device and methods of formation thereof'2008 7,378,646'Optical device package having optical feedthrough'2008 7,355,166'Optoelectronic component having electrical connection and formation method thereof'2008 7,352,924'Micro-optical device'2008 7,348,550'Optoelectronic component with front to side surface electrical conductor'2008 7,345,316'Wafer level packaging for optoelectronic devices'2008 7,329,056'Device package and methods for the fabrication and testing thereof'2008 7,294,280'External cavity semi-conductor laser and method for fabrication thereof'2007 7,291,833'Optoelectronic component'2007 7,292,756'Optical interface assembly and method of formation'2007 7,288,756'Optoelectronic component having passively aligned optoelectronic device'2007 7,288,758'Wafer-level optoelectronic device substrate'2007 7,267,781'Method of fabricating optical filters'2007 7,255,978'Multi-level optical structure and method of manufacture'2007 7,251,406'Optical waveguide termination with vertical and horizontal mode shaping'2007 7,246,953'Optical device package'2007 7,208,725'Optoelectronic component with encapsulant'2007 7,148,772'Coaxial waveguide microstructures having an active device and methods of formation thereof'2006 7,129,163'Device package and method for the fabrication and testing thereof'2006 7,079,725'Optical switch assembly with flex plate and method for making'2006 7,078,671'Silicon optical microbench devices and wafer-level testing thereof'2006 7,065,283'Optical waveguide devices and methods of fabricating the same'2006 7,026,697'Microstructures comprising a dielectric layer and a thin conductive layer'2006 7,024,090'Optical fiber array with variable fiber angle alignment and method for the fabrication thereof'2006 7,012,489'Coaxial waveguide microstructures and methods of formation thereof'2006 6,973,253'Optical waveguide devices and methods of fabricating the same'2005 6,964,804'Micromachined structures made by combined wet and dry etching'2005 6,932,519'Optical device package'2005 6,883,977'Optical device package for flip-chip mounting'2005 6,870,981'Optical switch and method for making'2005 6,866,426'Open face optical fiber array for coupling to integrated optic waveguides and optoelectronic submounts'2005 6,853,764'Optical switch assembly and method for making'2005 6,847,764'Optical interconnect having alignment depression'2005 6,842,552'Optical waveguide switch'2005 6,839,474'Optical assembly for coupling with integrated optical devices and method for making'2005 6,832,016'Fiber array switch having micromachined front face with roller balls'2004 6,826,324'Optical waveguide switch'2004 6,819,858'Fiber array with V-groove chip and mount'2004 6,811,853'Single mask lithographic process for patterning multiple types of surface features'2004 6,810,162'Optical switch assembly with flex plate and method for making'2004 6,799,897'Optical connector system'2004 6,786,649'Optical waveguide ferrule and method of making an optical waveguide ferrule'2004 6,768,590'Method of fabricating optical filters'2004 6,759,173'Single mask process for patterning microchip having grayscale and micromachined features'2004 6,748,131'Optical waveguide devices and methods of fabricating the same'2004 6,738,145'Micromachined, etalon-based optical fiber pressure sensor'2004 6,726,372'2-Dimensional optical fiber array made from etched sticks having notches'2004 6,698,295'Microstructures comprising silicon nitride layer and thin conductive polysilicon layer'2004 6,633,691'Optical waveguide switch having stepped waveguide holding member'2003 6,627,096'Single mask technique for making positive and negative micromachined features on a substrate'2003 6,595,700'Optoelectronic packages having insulation layers'2003 6,526,204'Optical fiber array for preventing flow of glue between fibers and waveguide'2003 6,501,619'Inductive magnetic recording head having inclined magnetic read/write pole and method of making same'2002 6,363,201'Fiber array with wick-stop trench for improved fiber positioning'2002 6,215,946'V-groove chip with wick-stop trench for improved fiber positioning'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2019Based in Radford, VA, US· patent location history

2002–2008Patents assigned to SHIPLEY CO LLC (39)· patent assignee history

2002–2008Based in Blacksburg, VA, US· patent location history

2006–2008Patents assigned to ROHM & HAAS ELECT MAT (13)· patent assignee history

2006Based in Fairlawn, VA, US· patent location history

2008–2018Patents assigned to NUVOTRONICS LLC (37)· patent assignee history

2012–2018Patents assigned to SHERRER DAVID W (10)· patent assignee history

2015–2019Based in Cary, NC, US· patent location history

2016–2019Patents assigned to NUVOTRONICS INC (26)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHIPLEY CO LLC	39	2002–2008
NUVOTRONICS LLC	37	2008–2018
NUVOTRONICS INC	26	2016–2019
ROHM & HAAS ELECT MAT	13	2006–2008
SHERRER DAVID Wself	10	2012–2018

Locations

Location	Patents	Span
Radford, Virginia, US	56	2001–2019
Blacksburg, Virginia, US	34	2002–2008
Cary, NC, US	21	2015–2019
Fairlawn, Virginia, US	1	2006