Inventor
Wen-Jung Chiang
Inventor
Kaohsiung, TW
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H02Mprimary
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01LSemiconductor devices11%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications11%
H02JElectric power networks7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G01RMeasuring electric variables4%
G05FSystems for regulating electric or magnetic variables4%
H05KPrinted circuits4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
9,887,102'Method for manufacturing multi-chip package'20189,825,547'Unidirectional isolated multi-level DC-DC converter and method thereof'20179,787,201'Bidirectional isolated multi-level DC-DC converter and method thereof'20179,438,132'Multilevel AC/DC power converting method and converter device thereof'20169,407,165'Cascade bridge-type DC-AC power conversion method and converter device thereof'20169,305,885'Multi-chip package and method for manufacturing the same'20169,065,349'Control method for bidirectional DC-DC converters'20158,981,540'Electronic device and package structure thereof'20158,923,027'Five-level DC-AC converter'20148,878,489'Estimation method for residual discharging time of batteries'20147,843,082'Islanding detection apparatus for a distributed generation power system and detection method therefor'20107,732,913'Semiconductor package substrate'20107,394,237'Maxium power point tracking method and tracking device thereof for a solar power system'20087,361,846'High electrical performance semiconductor package'20086,819,565'Cavity-down ball grid array semiconductor package with heat spreader'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2018Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (6)· patent assignee history
2004–2018Based in Taichung, TW· patent location history
2008–2017Patents assigned to ABLEREX ELECTRONICS CO LTD (9)· patent assignee history
2008–2016Based in Kaohsiung, TW· patent location history
2014–2015Patents assigned to CHIANG WEN-JUNG (3)· patent assignee history
2014Patents assigned to WU CHIN-CHANG (2)· patent assignee history
2015Patents assigned to CHANG JEN-CHIEH (1)· patent assignee history
2017Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ABLEREX ELECTRONICS CO LTD | 9 | 2008–2017 |
| SILICONWARE PRECISION INDUSTRIES CO LTD | 6 | 2004–2018 |
| CHIANG WEN-JUNGself | 3 | 2014–2015 |
| WU CHIN-CHANG | 2 | 2014 |
| CHANG JEN-CHIEH | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 7 | 2008–2016 |
| Taichung, TW | 6 | 2004–2018 |
| New Taipei, TW | 2 | 2017 |