LexDanaLexDanabeta
Inventor

Masaru Takeshita

Inventor
Kawasaki, JP

Overview

41→
Patents
1985–2016
Patent span
Physics
Primary field (CPC G)

Patents· 41 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices41%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests23%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds18%
C07CAcyclic or carbocyclic compounds6%
C07DHeterocyclic compounds3%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry1%
B23KSoldering or unsoldering1%
B26DCutting1%
B29DProducing particular articles from plastics or from substances in a plastic state1%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds1%
PatentTitleYear
9,411,224'Method of forming resist pattern'20169,023,577'Resist composition and method of forming resist pattern'20158,975,010'Method of forming resist pattern'20158,877,432'Method of forming resist pattern and resist composition'20148,614,049'Resist composition and method of forming resist pattern'20138,580,481'Resist polymer and resist composition'20138,535,868'Positive resist composition and method of forming resist pattern'20138,530,598'Resist composition for immersion exposure, method of forming resist pattern, and fluorine-containing resin'20138,497,395'Compound'20138,486,605'Positive resist composition and method of forming resist pattern'20138,338,075'Positive resist composition and method of forming resist pattern'20128,268,529'Positive resist composition, method of forming resist pattern using the same, and polymeric compound'20128,247,161'Resist composition for immersion exposure, method of forming resist pattern, and fluorine-containing resin'20128,247,159'Positive resist composition and method of forming resist pattern'20128,216,764'Positive resist composition and method of forming resist pattern'20128,097,396'Positive resist composition and method for forming resist pattern'20128,092,979'Resist polymer and resist composition'20127,972,762'Positive resist composition and method of forming resist pattern'20117,968,276'Positive resist composition and method of forming resist pattern'20117,964,331'Positive resist composition and method of forming resist pattern'20117,939,243'Resin, resist composition and method of forming resist pattern'20117,855,044'Positive resist composition and method of forming resist pattern'20107,829,259'Resin for photoresist composition, photoresist composition and method for forming resist pattern'20107,776,511'Positive resist composition and method of forming resist pattern'20107,767,378'Method for producing resist composition and resist composition'20107,763,412'Polymer, positive resist composition and method for forming resist pattern'20107,695,889'Copolymer for semiconductor lithography and process for production thereof'20107,682,770'Resist composition and method for forming resist pattern'20107,645,559'Positive resist composition and method of forming resist pattern'20107,638,258'Positive resist composition and method for resist pattern formation'20097,592,123'Resin for photoresist composition, photoresist composition and method for forming resist pattern'20097,575,846'Resist polymer and resist composition'20097,494,759'Positive resist compositions and process for the formation of resist patterns with the same'20097,491,485'Resist composition and method of forming resist pattern'20097,488,568'Resist composition, method of forming resist pattern, compound and acid generator'20097,482,108'Polymer compound, acid generator, positive resist composition, and method for formation of resist patterns'20097,312,015'Process for refining crude resin for electronic material'20076,161,752'Plate width center alignment method and apparatus for welding machine'20005,220,088'Process for dimerizating n-butene'19934,994,586'Method for preparing epoxy compound'19914,516,451'Apparatus for cutting an elongate rubbery strip'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991Based in Osaka, JP· patent location history
1993Based in Izumi, JP· patent location history
2000Based in Tokyo, JP· patent location history
2007–2016Patents assigned to TOKYO OHKA KOGYO CO LTD (33)· patent assignee history
2007–2016Based in Kawasaki, JP· patent location history
2009–2013Based in Kanagawa, JP· patent location history
2012–2016Patents assigned to TAKESHITA MASARU (16)· patent assignee history
2012–2016Patents assigned to NAKAMURA TSUYOSHI (5)· patent assignee history
2012–2014Patents assigned to YOSHII YASUHIRO (5)· patent assignee history
2013–2016Patents assigned to SAITO HIROKUNI (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO OHKA KOGYO CO LTD332007–2016
TAKESHITA MASARUself162012–2016
NAKAMURA TSUYOSHI52012–2016
YOSHII YASUHIRO52012–2014
SAITO HIROKUNI42013–2016
Locations
LocationPatentsSpan
Kawasaki, JP312007–2016
Kanagawa, JP62009–2013
Tokyo, JP12000
Izumi, JP11993
Osaka, JP11991