Inventor

Man Chan

Inventor

Singapore, SG

Overview

5→

Patents

2006–2016

Patent span

Electricity

Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%

B23KSoldering or unsoldering14%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

Y10TTechnical subjects covered by former us classification14%

B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general7%

H01LSemiconductor devices7%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%

PatentTitleYear

9,484,241'Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding'2016 7,997,470'Flanged transducer having improved rigidity'2011 7,766,211'Temperature control of a bonding stage'2010 7,681,775'Multi-layer thermal insulation for a bonding system'2010 7,100,812'Capillary holder'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2016Patents assigned to ASM TECH SINGAPORE PTE LTD (5)· patent assignee history

2006–2011Based in Singapore, SG· patent location history

2016Patents assigned to CHAN MAN CHUNG (1)· patent assignee history

2016Patents assigned to FAN CHUN HO (1)· patent assignee history

2016Based in Kwai Chung, HK· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ASM TECH SINGAPORE PTE LTD	5	2006–2016
CHAN MAN CHUNGself	1	2016
FAN CHUN HO	1	2016

Locations

Location	Patents	Span
Singapore, SG	4	2006–2011
Kwai Chung, HK	1	2016