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Inventor

Naoya Yasuda

Inventor
Tokyo, JP

Overview

3→
Patents
2004–2010
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
PatentTitleYear
7,763,966'Resin molded semiconductor device and differential amplifier circuit'20107,622,799'Semiconductor device, interposer chip and manufacturing method of semiconductor device'20096,713,882'Resin sealing apparatus and resin sealing method'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2010Patents assigned to RENESAS TECH CORP (3)· patent assignee history
2004–2010Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS TECH CORP32004–2010
Locations
LocationPatentsSpan
Tokyo, JP32004–2010