Inventor
Yukio Takigawa
Inventor
Kawasaki, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
C08LCompositions of macromolecular compounds7%
G21CNuclear reactors7%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
B01DSeparation2%
B03CMagnetic or electrostatic separation of solid materials from solid materials or fluids2%
B08BCleaning in general2%
PatentTitleYear
8,675,808'Natural circulation type boiling water reactor'20147,811,936'Method of producing semiconductor device'20107,709,394'Substrate processing method and apparatus fabrication process of a semiconductor device'20107,481,264'Steam condenser'20097,390,741'Method for fabricating semiconductor device'20087,211,519'Method for manufacturing semiconductor device'20076,943,115'Semiconductor device and method of manufacture thereof'20056,693,046'Method of manufacturing semiconductor device having multilevel wiring'20046,656,996'Semiconductor-sealing resin composition and semiconductor device using it'20036,565,419'Method of removing particles from stage and cleaning plate'20036,361,879'Semiconductor device and method for fabricating it, and semiconductor sealing resin composition'20026,338,903'Resin composition for semiconductor encapsulation, method and apparatus for producing the composition, as well as semiconductor device using the composition'20026,278,192'Semiconductor device with encapsulating material composed of silica'20015,844,309'Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition'19985,763,540'Epoxy resin composition for encapsulating semiconductor'19985,659,004'Epoxy resin composition'19975,406,598'System for monitoring power of nuclear reactor'19954,319,959'Method of supervising the channel stability in reactor cores of nuclear reactors'19824,115,516'Method of treating exhaust gas discharged from nitric acid plant'1978Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1978Based in Kitakyushu, JP· patent location history
1982–2010Based in Kawasaki, JP· patent location history
1995–2014Patents assigned to TOSHIBA KK (3)· patent assignee history
1997–2010Patents assigned to FUJITSU LTD (13)· patent assignee history
2003Patents assigned to ADVANTEST CORP (1)· patent assignee history
2010Patents assigned to EBARA CORP (1)· patent assignee history
2014Patents assigned to ABE NOBUAKI (1)· patent assignee history
2014Based in Yokohama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 13 | 1997–2010 |
| TOSHIBA KK | 3 | 1995–2014 |
| ABE NOBUAKI | 1 | 2014 |
| ADVANTEST CORP | 1 | 2003 |
| EBARA CORP | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 17 | 1982–2010 |
| Yokohama, JP | 1 | 2014 |
| Kitakyushu, JP | 1 | 1978 |