Inventor
Danfeng YANG
Inventor
CN
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01LSemiconductor devices32%
H05KPrinted circuits9%
H10DInorganic electric semiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H01QAntennas, i.e. radio aerials5%
PatentTitleYear
12,593,731Packaging structure and manufacturing method thereof202612,581,965Packaging structure and manufacturing method thereof202612,550,261Package structure with inductor, and manufacturing method thereof202612,525,478System and method of providing FOUP or cassette supporting structure for handling various size or shape wafers and panels202612,500,329Antenna packaging structure and manufacturing method thereof202512,482,765Packaging structure and manufacturing method thereof202512,249,582SIP package structure202512,148,681Fan-out package structure and method for manufacturing the same202411,854,949Package structure having a plurality of chips attached to a lead frame by redistribution layer2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to JCET GROUP CO LTD (8)· patent assignee history
2023–2026Based in CN· patent location history
2026Patents assigned to STATS CHIPPAC PTE LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JCET GROUP CO LTD | 8 | 2023–2026 |
| STATS CHIPPAC PTE LTD | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 9 | 2023–2026 |